The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

Sep. 15, 2015
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Yen-Ru Lee, Hsinchu, TW;

Chii-Horng Li, Hsinchu County, TW;

Chien-I Kuo, Hsinchu, TW;

Heng-Wen Ting, Hsinchu, TW;

Jung-Chi Tai, Hsinchu, TW;

Lilly Su, Hsinchu County, TW;

Tzu-Ching Lin, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 21/283 (2006.01); H01L 21/306 (2006.01); H01L 21/762 (2006.01); H01L 21/764 (2006.01); H01L 29/08 (2006.01); H01L 29/78 (2006.01); H01L 21/02 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0649 (2013.01); H01L 21/0243 (2013.01); H01L 21/0262 (2013.01); H01L 21/02433 (2013.01); H01L 21/02529 (2013.01); H01L 21/283 (2013.01); H01L 21/30604 (2013.01); H01L 21/764 (2013.01); H01L 21/76224 (2013.01); H01L 29/0847 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01); H01L 21/3065 (2013.01);
Abstract

A semiconductor device includes a substrate, at least one first isolation structure, at least two second isolation structure, and an epitaxy structure. The substrate has a plurality of semiconductor fins therein. The first isolation structure is disposed between the semiconductor fins. The semiconductor fins are disposed between the second isolation structures, and the second isolation structures extend into the substrate further than the first isolation structure. The epitaxy structure is disposed on the semiconductor fins. At least one void is present between the first isolation structure and the epitaxy structure.


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