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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9893444 B1

PDFFull Text
Expired
Date of Patent:
Feb. 13, 2018

Filed:

Sep. 24, 2015

Board-edge interconnection module with integrated capacitive coupling for enabling ultra-mobile computing devices

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jackson Chung Peng Kong, Tanjung Tokong, MY;

Eng Huat Goh, Ayer Itam, MY;

Bok Eng Cheah, Bayan Lepas, MY;

Su Sin Florence Phun, Bayan Lepas, MY;

Khang Choong Yong, Puchong, MY;

Min Keen Tang, Taman Sri Nibong, MY;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

International IP Law Group, P.L.L.C.

Primary Examiner:

Felix O Figueroa

Int. Cl.
CPC ...
H01R 12/73 (2011.01); H01R 12/72 (2011.01); C25D 7/00 (2006.01); C25D 5/34 (2006.01); C25D 5/48 (2006.01); H01R 13/66 (2006.01); H05K 3/00 (2006.01); H01G 4/06 (2006.01); H01G 4/228 (2006.01); H01G 4/40 (2006.01);
U.S. Cl.
CPC ...
H01R 12/721 (2013.01); C25D 5/34 (2013.01); C25D 5/48 (2013.01); C25D 7/00 (2013.01); H01R 13/6625 (2013.01); H05K 3/00 (2013.01); H01G 4/06 (2013.01); H01G 4/228 (2013.01); H01G 4/40 (2013.01); H01R 12/732 (2013.01);
Abstract

A board-edge interconnection module features integrated capacitive coupling, which enables a board design employing the module to avoid having AC capacitors and flexible cables with bulky connectors. The recovered real estate enables further miniaturization, enabling the component to be used on a wide variety of devices, including ultra-mobile computing devices.

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Quick Actions:

Kong, Jackson Chung Peng. (2018). Board-edge interconnection module with integrated capacitive coupling for enabling ultra-mobile computing devices (U.S. Patent No. 9893444). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9893444

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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