The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2018
Filed:
Apr. 11, 2014
Applicant:
Xintec Inc., Jhongli, Taoyuan County, TW;
Inventors:
Yu-Lung Huang, Daxi Township, TW;
Shu-Ming Chang, New Taipei, TW;
Tsang-Yu Liu, Zhubei, TW;
Yen-Shih Ho, Kaohsiung, TW;
Assignee:
XINTEC INC., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 21/78 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 24/94 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/97 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/131 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14145 (2013.01); H01L 2224/14177 (2013.01); H01L 2224/14179 (2013.01); H01L 2224/16058 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17051 (2013.01); H01L 2224/17517 (2013.01); H01L 2224/17519 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81986 (2013.01); H01L 2224/92 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A chip package is provided, in which includes: a packaging substrate, a chip and a plurality solder balls interposed between the packaging substrate and the chip for bonding the packaging substrate and the chip, wherein the solder balls include a first portion of a first size and a second portion of a second size that is different from the first size.