The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2018

Filed:

Jan. 20, 2016
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Hui Chen, San Jose, CA (US);

Steven M. Zuniga, Soquel, CA (US);

Hung Chih Chen, Sunnyvale, CA (US);

Eric Lau, Santa Clara, CA (US);

Garrett Ho Yee Sin, Sunnyvale, CA (US);

Shou-Sung Chang, Mountain View, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/20 (2012.01); B24B 37/30 (2012.01);
U.S. Cl.
CPC ...
B24B 37/20 (2013.01); B24B 37/30 (2013.01);
Abstract

A chemical mechanical polishing system includes a substrate support configured to hold a substrate during a polishing operation, a polishing pad assembly include a membrane and a polishing pad portion, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad carrier includes a casing having a cavity and an aperture connecting the cavity to an exterior of the casing. The polishing pad assembly is positioned in the casing such that the membrane divides the cavity into a first chamber and a second chamber and the aperture extends from the second chamber. The polishing pad carrier and polishing pad assembly are positioned and configured such that at least during application of a sufficient pressure to the first chamber the polishing pad portion projects through the aperture.


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