The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

Jun. 17, 2016
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Jun Sato, Iwate, JP;

Hiroyuki Kikuchi, Iwate, JP;

Masahiro Murata, Iwate, JP;

Shigehiro Miura, Iwate, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); C23C 16/455 (2006.01); C23C 16/04 (2006.01); C23C 16/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76802 (2013.01); C23C 16/045 (2013.01); C23C 16/402 (2013.01); C23C 16/45534 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/02211 (2013.01); H01L 21/02271 (2013.01); H01L 21/31116 (2013.01); H01L 21/67069 (2013.01); H01L 21/68714 (2013.01);
Abstract

A method for depositing a silicon-containing film is performed by causing a silicon-containing gas to adsorb on a first surface of a depression formed in a second surface of a substrate by supplying the silicon-containing gas to the substrate. A silicon component contained in the silicon-containing gas adsorbed on the first surface of the depression is partially etched by supplying an etching gas to the substrate. A silicon-containing film is deposited in the depression by supplying a reaction gas reactable with the silicon component to the substrate so as to produce a reaction product by causing the reaction gas to react with the silicon component left in the depression without being etched.


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