The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2017
Filed:
Dec. 29, 2014
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Chen-Hua Yu, Hsinchu, TW;
HsiaoYun Lo, Hsinchu, TW;
Yi-Hsiu Chen, Hsinchu, TW;
Wen-Chih Chiou, Zhunan Township, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsin-Chu, TW;
Abstract
A chip-stacking apparatus for stacking a chip on a substrate is provided. The chip-stacking apparatus includes a substrate support configured to carry the substrate and a transport device configured to dispose a chip to the substrate. The transport device includes a bond head including a bond base and an attaching element disposed on the bond base and configured to allow the chip to be attached thereon. The center area of the attaching element is higher than an edge area of the attaching element relative to the bond base.