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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9799615 B1

PDFFull Text
Date of Patent:
Oct. 24, 2017

Filed:

Jul. 20, 2016

Package structures having height-adjusted molding members and methods of forming the same

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chang-Pin Huang, Taoyuan, TW;

Chung-Shi Liu, Hsinchu, TW;

Hsien-Ming Tu, Hsinchu County, TW;

Hung-Yi Kuo, Taipei, TW;

Hao-Yi Tsai, Hsinchu, TW;

Shih-Wei Liang, Taichung, TW;

Yu-Chia Lai, Miaoli County, TW;

Ren-Xuan Liu, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Attorney:

JCIPRNet

Primary Examiner:

Scott B Geyer

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/02 (2013.01); H01L 21/566 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/02315 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02351 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05024 (2013.01); H01L 2224/13026 (2013.01);
Abstract

Package structures and methods of forming the same are disclosed. A package structure includes a die, a molding member and a redistribution circuit structure. The die includes a semiconductor substrate, a connector and a passivation layer. The semiconductor substrate has a top surface. The connector is disposed over the top surface of the semiconductor substrate. The passivation layer is disposed over the top surface of the semiconductor substrate and exposes a portion of the connector. The molding member laterally surrounds the semiconductor substrate, wherein a top surface of the molding member is higher than the top surface of the semiconductor substrate and the molding member forms a hooking structure that embraces over an edge portion of the semiconductor substrate. The redistribution circuit structure extends over the passivation layer and the molding member, and is electrically connected to the connector.

Find Patent Forward Citations

Huang, Chang-Pin. (2017). Package structures having height-adjusted molding members and methods of forming the same (U.S. Patent No. 9799615). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9799615

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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