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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9786628 B1

PDFFull Text
Date of Patent:
Oct. 10, 2017

Filed:

Nov. 21, 2016

Air trench in packages incorporating hybrid bonding

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Bruce C. S. Chou, Hsin-Chu, TW;

Chen-Jong Wang, Bao-Shan, TW;

Ping-Yin Liu, Yonghe, TW;

Jung-Kuo Tu, Hsin-Chu, TW;

Tsung-Te Chou, Taipei, TW;

Xin-Hua Huang, Xihu Township, TW;

Hsun-Chung Kuang, Hsin-Chu, TW;

Lan-Lin Chao, Sindian, TW;

Chia-Shiung Tsai, Hsin-Chu, TW;

Xiaomeng Chen, Baoshan Township, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Roy Potter

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 21/308 (2006.01); H01L 21/764 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 24/80 (2013.01); H01L 21/3081 (2013.01); H01L 21/764 (2013.01); H01L 23/498 (2013.01); H01L 23/5226 (2013.01); H01L 23/53228 (2013.01); H01L 23/53295 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/09 (2013.01); H01L 24/83 (2013.01); H01L 24/93 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 23/5329 (2013.01); H01L 23/53204 (2013.01); H01L 2224/03845 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/0601 (2013.01); H01L 2224/08147 (2013.01); H01L 2224/0901 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2225/06524 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/351 (2013.01);
Abstract

A package component includes a surface dielectric layer including a planar top surface, a metal pad in the surface dielectric layer and including a second planar top surface level with the planar top surface, and an air trench on a side of the metal pad. The sidewall of the metal pad is exposed to the air trench.

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