The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2017

Filed:

Sep. 26, 2014
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Dhanya Athreya, Chandler, AZ (US);

Gaurav Chawla, Tempe, AZ (US);

Kemal Aygun, Chandler, AZ (US);

Glen P. Gordon, Graham, WA (US);

Sarah M. Canny, Hillsboro, OR (US);

Jeffory L. Smalley, East Olympia, WA (US);

Srikant Nekkanty, Chandler, AZ (US);

Michael Garcia, Chandler, AZ (US);

Joshua D. Heppner, Chandler, AZ (US);

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 24/00 (2011.01); H01R 33/76 (2006.01); H01L 23/32 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01R 33/7685 (2013.01); H01L 23/32 (2013.01); H01L 23/49827 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.


Find Patent Forward Citations

Loading…