The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

May. 04, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Shuhong Liu, Chandler, AZ (US);

Zhiyong Wang, Chandler, AZ (US);

Nilanjan Z. Ghosh, Chandler, AZ (US);

Deepak Goyal, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 11/02 (2006.01); G01N 21/95 (2006.01); G01B 9/02 (2006.01); G01B 11/06 (2006.01); G01N 21/956 (2006.01); G02B 21/00 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01B 9/0203 (2013.01); G01B 9/0209 (2013.01); G01B 11/0675 (2013.01); G01N 21/956 (2013.01); G02B 21/0016 (2013.01); G01B 2210/56 (2013.01);
Abstract

Embodiments include devices, systems and processes for using a white light interferometer (WLI) microscope with a tilted objective lens to perform in-line monitoring of both resist footing defects and conductive trace undercut defects. The defects may be detected at the interface between dry film resist (DFR) footings and conductive trace footing found on insulating layer top surfaces of a packaging substrate. Such footing and undercut defects may other wise be considered 'hidden defects'. Using the WLI microscope with a tilted objective lens provides a high-throughput and low cost metrology and tool for non-destructive, non-contact, in-line monitoring.


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