The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

Mar. 04, 2016
Applicant:

Alpha and Omega Semiconductor Incorporated;

Inventors:

Yeeheng Lee, San Jose, CA (US);

Lingpeng Guan, Sunnyvale, CA (US);

Hongyong Xue, Portland, OR (US);

Yiming Gu, Hillsboro, OR (US);

Yang Xiang, Beaverton, OR (US);

Terence Huang, Portland, OR (US);

Sekar Ramamoorthy, Beaverton, OR (US);

Wenjun Li, Shanghai, CN;

Hong Chang, Cupertino, CA (US);

Madhur Bobde, San Jose, CA (US);

Paul Thorup, Hillsboro, OR (US);

Hamza Yilmaz, Saratoga, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 21/28 (2006.01); H01L 29/40 (2006.01); H01L 27/088 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4236 (2013.01); H01L 21/28008 (2013.01); H01L 27/088 (2013.01); H01L 29/404 (2013.01); H01L 29/407 (2013.01); H01L 29/4238 (2013.01); H01L 29/42364 (2013.01); H01L 29/42376 (2013.01); H01L 29/66484 (2013.01); H01L 29/66613 (2013.01); H01L 29/66734 (2013.01); H01L 29/78 (2013.01); H01L 29/7811 (2013.01); H01L 29/7813 (2013.01);
Abstract

A plurality of gate trenches is formed into a semiconductor substrate in an active cell region. One or more other trenches are formed in a different region. Each gate trench has a first conductive material in lower portions and a second conductive material in upper portions. In the gate trenches, a first insulating layer separates the first conductive material from the substrate, a second insulating layer separates the second conductive material from the substrate and a third insulating material separates the first and second conductive materials. The other trenches contain part of the first conductive material in a half-U shape in lower portions and part of the second conductive material in upper portions. In the other trenches, the third insulating layer separates the first and second conductive materials. The first insulating layer is thicker than the third insulating layer, and the third insulating layer is thicker than the second.


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