The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9741589 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 22, 2017

Filed:

Jul. 10, 2015
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Hao-Juin Liu, Kaohsiung, TW;

Chita Chuang, Hsin-Chu, TW;

Yao-Chun Chuang, Hsin-Chu, TW;

Ming Hung Tseng, Toufen Township, TW;

Chen-Shien Chen, Zhubei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 23/13 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4821 (2013.01); H01L 21/4825 (2013.01); H01L 21/4842 (2013.01); H01L 23/13 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 23/5384 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H05K 1/0296 (2013.01); H05K 1/112 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13564 (2013.01); H01L 2224/13601 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13624 (2013.01); H01L 2224/13639 (2013.01); H01L 2224/13644 (2013.01); H01L 2224/13647 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/181 (2013.01); H01L 2924/351 (2013.01); Y10T 29/49149 (2015.01);
Abstract

A structure comprises a plurality of top pads protruding over a top surface of a package substrate, wherein a top pad comprises a first half-circle portion, a second half-circle portion and a first rectangular portion between the first half-circle portion and the second half-circle portion, a plurality of bottom pads embedded in the package substrate, wherein a bottom pad comprises a third half-circle portion, a fourth half-circle portion and a second rectangular portion between the third half-circle portion and the fourth half-circle portion and a plurality of vias coupled between the top pads and their respective bottom pads.


Find Patent Forward Citations

Liu, Hao-Juin. (2017). Substrate pad structure (U.S. Patent No. 9741589). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9741589

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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