The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

Jan. 23, 2014
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Satoru Shimura, Koshi, JP;

Fumiko Iwao, Tokyo, JP;

Kousuke Yoshihara, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B05C 9/12 (2006.01); B05C 9/14 (2006.01); B05C 11/10 (2006.01); H01L 21/66 (2006.01); H01L 21/3105 (2006.01); H01L 21/311 (2006.01); H01L 21/67 (2006.01); H01L 21/027 (2006.01); B05C 11/08 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02348 (2013.01); B05C 9/12 (2013.01); B05C 9/14 (2013.01); B05C 11/1015 (2013.01); H01L 21/0271 (2013.01); H01L 21/31055 (2013.01); H01L 21/31138 (2013.01); H01L 21/6715 (2013.01); H01L 21/6719 (2013.01); H01L 21/67109 (2013.01); H01L 21/67115 (2013.01); H01L 21/67178 (2013.01); H01L 22/20 (2013.01); H01L 22/26 (2013.01); B05C 11/08 (2013.01); H01L 21/02118 (2013.01); H01L 22/12 (2013.01);
Abstract

The present invention is to form an organic film on a substrate having a pattern formed on a front surface thereof and configured to: apply an organic material onto the substrate; then thermally treat the organic material to form an organic film on the substrate; and then perform ultraviolet irradiation processing on the organic film to remove a surface of the organic film down to a predetermined depth, thereby appropriately and efficiently form the organic film on the substrate.

Published as:
WO2014129259A1; JP2014165252A; TW201440900A; KR20150124950A; CN105074883A; US2015357188A1; JP5934665B2; TWI565533B; TW201708982A; US9741559B2; CN105074883B; TWI598703B; KR101959108B1;

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