The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Dec. 04, 2015
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Chuei-Tang Wang, Hsin-Chu, TW;

Chung-Hao Tsai, Hsin-Chu, TW;

Chen-Hua Yu, Hsin-Chu, TW;

Jeng-Shien Hsieh, Hsin-Chu, TW;

Wei-Heng Lin, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/56 (2013.01); H01L 23/3114 (2013.01); H01L 21/76898 (2013.01);
Abstract

A method includes forming a first metal plate, forming a metal ring aligned to peripheral regions of the first metal plate, and placing a device die level with the metal ring, encapsulating the device die and the metal ring in an encapsulating material. The method further includes filling a dielectric material into a space encircled by the metal ring, and forming a second metal plate covering the dielectric material and the metal ring, with an opening formed in the second metal plate. A plurality of redistribution lines is formed, with one of the redistribution lines overlapping a portion of the opening. The first metal plate, the metal ring, the second metal plate, and the dielectric material in combination form an antenna or a waveguide. The redistribution line forms a signal-coupling line of the passive device.


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