The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Dec. 20, 2013
Applicant:

Carl Zeiss Smt Gmbh, Oberkochen, DE;

Inventors:

Alexey Kuznetzov, Utrecht, NL;

Michael Gleeson, Leiderdorp, NL;

Robbert W. E. Van De Kruijs, Nieuwegein, NL;

Frederik Bijkerk, Bosch en Duin, NL;

Assignee:

Carl Zeiss SMT GmbH, Oberkochen, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); C23C 14/54 (2006.01); C23C 14/35 (2006.01); G02B 5/08 (2006.01); G21K 1/06 (2006.01); B82Y 10/00 (2011.01);
U.S. Cl.
CPC ...
G03F 7/70958 (2013.01); B82Y 10/00 (2013.01); C23C 14/35 (2013.01); C23C 14/542 (2013.01); G02B 5/0875 (2013.01); G02B 5/0891 (2013.01); G21K 1/062 (2013.01);
Abstract

A method aleviating blistering, cracking and chipping in topmost layers of a multilayer system exposed to reactive hydrogen, when producing a reflective optical element () having a maximum reflectivity at an operating wavelength of 5 nm to 20 nm. A multilayer system () composed of 30-60 stacks () is applied to a substrate (). Each stack has a layer () of thickness dcomposed of a high refractive index material and a layer () of thickness dcomposed of a low refractive index material. The thickness ratio is d/(d+d)=Γ. Two to five further stacks () are applied to the multilayer system. at least one further stack having a layer () of thickness dcomposed of a high refractive index material and a layer () of thickness dcomposed of a low refractive index material, wherein the thickness ratio is d/(d+d)=Γ and wherein Γ≠Γ.


Find Patent Forward Citations

Loading…