The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

Jun. 05, 2009
Applicants:

Christophe Fouquet, Sunnyvale, CA (US);

Zain Saidin, San Mateo, CA (US);

Sergio Edelstein, Boston, MA (US);

Savitha Nanjangud, San Jose, CA (US);

Carl Hess, Los Altos, CA (US);

Inventors:

Christophe Fouquet, Sunnyvale, CA (US);

Zain Saidin, San Mateo, CA (US);

Sergio Edelstein, Boston, MA (US);

Savitha Nanjangud, San Jose, CA (US);

Carl Hess, Los Altos, CA (US);

Assignee:

KLA-Tencor Corp., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 21/66 (2006.01); G06T 7/00 (2017.01); G03F 7/20 (2006.01); G01N 21/956 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0006 (2013.01); G06F 17/5081 (2013.01); H01L 22/12 (2013.01); G01N 21/956 (2013.01); G03F 7/705 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/30148 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Various systems and methods for detecting design and process defects on a wafer, reviewing defects on a wafer, selecting one or more features within a design for use as process monitoring features, or some combination thereof are provided. One system is configured to detect design defects and process defects at locations on a wafer at which images are acquired by an electron beam review subsystem based on defects in a design, additional defects in the design, which are detected by comparing an image of a die in the design printed on the wafer acquired by the electron beam review subsystem to an image of the die stored in a database, and defects detected on the wafer by a wafer inspection system.


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