The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

May. 20, 2011
Applicants:

Chie Shishido, Kawasaki, JP;

Maki Tanaka, Tokyo, JP;

Katsuhiro Sasada, Hitachinaka, JP;

Inventors:

Chie Shishido, Kawasaki, JP;

Maki Tanaka, Tokyo, JP;

Katsuhiro Sasada, Hitachinaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 15/04 (2006.01); G01Q 40/00 (2010.01); H01J 37/26 (2006.01); H01J 37/28 (2006.01);
U.S. Cl.
CPC ...
G01B 15/04 (2013.01); G01Q 40/00 (2013.01); H01J 37/263 (2013.01); H01J 37/28 (2013.01); H01J 2237/22 (2013.01); H01J 2237/24514 (2013.01); H01J 2237/24578 (2013.01); H01J 2237/2823 (2013.01); H01J 2237/2826 (2013.01);
Abstract

Beforehand, the device characteristic patterns of each critical dimension SEM are measured, a sectional shape of an object to undergo dimension measurement is presumed by a model base library (MBL) matching system, dimension measurements are carried out by generating signal waveforms through SEM simulation by inputting the presumed sectional shapes and the device characteristic parameters, and differences in the dimension measurement results are registered as machine differences. In actual measurements, from the dimension measurement results in each critical dimension SEM, machine differences are corrected by subtracting the registered machine differences. Furthermore, changes in critical dimension SEM's over time are monitored by periodically measuring the above-mentioned device characteristic parameters and predicting the above-mentioned dimension measurement results. According to the present invention, actual measurements of machine differences, which require considerable time and effort, are unnecessary. In addition, the influence of changes in samples over time, which is problematic in monitoring changes in devices over time, can be eliminated.


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