The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Jul. 27, 2015
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
I-Chih Chen, Tainan, TW;
Ying-Hao Chen, Tainan, TW;
Chi-Cherng Jeng, Tainan, TW;
Volume Chien, Tainan, TW;
Fu-Tsun Tsai, Tainan, TW;
Kun-Huei Lin, Tainan, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsin-chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/48 (2006.01); G06F 17/50 (2006.01); H01L 23/31 (2006.01); H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); G06F 17/5077 (2013.01); H01L 21/76805 (2013.01); H01L 21/76877 (2013.01); H01L 21/76897 (2013.01); H01L 23/3171 (2013.01); H01L 23/481 (2013.01); H01L 23/522 (2013.01); H01L 23/528 (2013.01); H01L 23/5283 (2013.01); H01L 23/5329 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/94 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05085 (2013.01); H01L 2224/05092 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05684 (2013.01); H01L 2224/16145 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device includes a first layer including a number of first layer metal pads, a second layer formed on top of the first layer, the second layer including a number of second layer metal pads, and vias connecting the first layer metal pads to the second layer metal pads. A surface area overlap between the first layer metal pads and the second layer metal pads is below a defined threshold.