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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9633974 B1

PDFFull Text
Date of Patent:
Apr. 25, 2017

Filed:

Mar. 04, 2015

System in package fan out stacking architecture and process flow

Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Jun Zhai, Cupertino, CA (US);

Kunzhong Hu, Cupertino, CA (US);

Kwan-Yu Lai, Campbell, CA (US);

Mengzhi Pang, Cupertino, CA (US);

Chonghua Zhong, Cupertino, CA (US);

Se Young Yang, San Jose, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:

Blakely, Sokoloff, Taylor & Zafman LLP

Primary Examiner:

Long Pham

Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 21/568 (2013.01); H01L 23/3135 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 25/50 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/08167 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/27318 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83874 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/94 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19105 (2013.01);
Abstract

Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), and a plurality of die attached to the front and back side of the first RDL. The first and second RDLs are coupled together with a plurality of conductive pillars extending from the back side of the first RDL to a front side of the second RDL.

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Quick Actions:

Zhai, Jun. (2017). System in package fan out stacking architecture and process flow (U.S. Patent No. 9633974). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9633974

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