The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Jun. 11, 2013
Applicant:

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Inventors:

Shinsuke Fujiwara, Itami, JP;

Taro Nishiguchi, Itami, JP;

Tsutomu Hori, Itami, JP;

Naoki Ooi, Itami, JP;

Shunsaku Ueta, Itami, JP;

Assignee:

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 23/08 (2006.01); C30B 23/06 (2006.01); C30B 29/36 (2006.01); C30B 23/00 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C30B 23/066 (2013.01); C30B 23/00 (2013.01); C30B 29/36 (2013.01); H01L 21/02529 (2013.01); H01L 21/02645 (2013.01); H01L 21/02664 (2013.01);
Abstract

A method of manufacturing a silicon carbide substrate has the following steps. A silicon carbide source material is partially sublimated. After partially sublimating the silicon carbide source material, a seed substrate having a main surface is placed in a growth container. By sublimating the remainder of the silicon carbide source material in the growth container, a silicon carbide crystal grows on the main surface of the seed substrate. In this way, an increase of dislocations in the main surface of the seed substrate can be suppressed, thereby providing a method of manufacturing a silicon carbide substrate having few dislocations.


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