The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Apr. 01, 2015
Applicant:
Xintec Inc., Taoyuan, TW;
Inventors:
Yen-Shih Ho, Kaohsiung, TW;
Tsang-Yu Liu, Zhubei, TW;
Chia-Sheng Lin, Taoyuan, TW;
Yi-Ming Chang, Taoyuan, TW;
Assignee:
XINTEC INC., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B81C 1/00 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 27/146 (2006.01); B81B 7/00 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00896 (2013.01); B81B 7/007 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 24/11 (2013.01); H01L 24/43 (2013.01); H01L 24/83 (2013.01); H01L 27/14618 (2013.01); H01L 27/14687 (2013.01); B81B 2207/096 (2013.01); H01L 23/544 (2013.01); H01L 2221/68327 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/8385 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/05032 (2013.01); H01L 2924/05432 (2013.01);
Abstract
A method for forming a chip package is provided. The method includes providing a substrate and a capping layer, wherein the substrate has a sensing device therein adjacent to a surface of the substrate. The capping layer is attached to the surface of the substrate by an adhesive layer, wherein the adhesive layer covers the sensing device. A dicing process is performed on the substrate, the adhesive layer, and the capping layer along a direction to form individual chip packages.