The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Oct. 14, 2015
Applicant:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

Inventors:

Xiaobing Mei, Manhattan Beach, CA (US);

Ling-Shine Lee, Torrance, CA (US);

Michael D. Lange, Anaheim, CA (US);

Wayne Yoshida, Redondo Beach, CA (US);

Po-Hsin Liu, Anaheim, CA (US);

Assignee:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/338 (2006.01); H01L 29/66 (2006.01); H01L 21/027 (2006.01); H01L 21/311 (2006.01); H01L 29/423 (2006.01); H01L 29/205 (2006.01); H01L 21/283 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66462 (2013.01); H01L 21/0277 (2013.01); H01L 21/283 (2013.01); H01L 21/31111 (2013.01); H01L 21/31116 (2013.01); H01L 21/31133 (2013.01); H01L 29/205 (2013.01); H01L 29/42316 (2013.01);
Abstract

A method for fabricating a double-recess gate structure for an FET device that includes providing a semiconductor wafer having a plurality of semiconductor layers and depositing an EBL resist layer on the wafer. The method also includes patterning the EBL resist layer to form an opening in the EBL resist layer and performing a first wet etch to form a first recess in the wafer. The method further includes depositing a dielectric layer over the EBL resist layer and into the first recess and performing a dry etch to remove a portion of the dielectric layer in the first recess. The method also includes performing a second wet etch through the opening in the dielectric layer to form a second recess, and depositing a gate metal layer in the first and second recesses and in the opening in the EBL resist layer to form a gate terminal.


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