The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Sep. 11, 2013
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yoshihide Kihara, Miyagi, JP;

Hiromi Mochizuki, Miyagi, JP;

Masanobu Honda, Miyagi, JP;

Masaya Kawamata, Miyagi, JP;

Ken Kobayashi, Miyagi, JP;

Ryoichi Yoshida, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/027 (2006.01); H01L 21/3213 (2006.01); H01J 37/32 (2006.01); H01L 21/3065 (2006.01); H01L 21/687 (2006.01); G03F 7/40 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31144 (2013.01); H01J 37/32082 (2013.01); H01J 37/32541 (2013.01); H01J 37/32568 (2013.01); H01J 37/32577 (2013.01); H01J 37/32733 (2013.01); H01L 21/0273 (2013.01); H01L 21/31116 (2013.01); H01L 21/31138 (2013.01); H01L 21/32136 (2013.01); G03F 7/40 (2013.01); H01L 21/3065 (2013.01); H01L 21/67109 (2013.01); H01L 21/6831 (2013.01); H01L 21/68764 (2013.01);
Abstract

A method of processing a target object includes (a) exposing a resist mask to active species of hydrogen generated by exciting plasma of a hydrogen-containing gas within a processing vessel while the target object is mounted on a mounting table provided in the processing vessel; and (b) etching a hard mask layer by exciting plasma of an etchant gas within the processing vessel after the exposing of the resist mask to the active species of hydrogen. The plasma is excited by applying of a high frequency power for plasma excitation to an upper electrode. In the method, a distance between the upper electrode and the mounting table in the etching of the hard mask layer ((b) process) is set to be larger than a distance between the upper electrode and the mounting table in the exposing of the resist mask to the active species of hydrogen ((a) process).


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