The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
Jan. 18, 2016
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Tung-Liang Shao, Hsin-Chu, TW;
Chih-Hang Tung, Hsin-Chu, TW;
Wen-Lin Shih, Hsin-Chu, TW;
Hsiao-Yun Chen, Hsin-Chu, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/44 (2006.01); H01L 23/00 (2006.01); B23K 1/00 (2006.01); B23K 1/06 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); B23K 1/0016 (2013.01); B23K 1/06 (2013.01); H01L 24/08 (2013.01); H01L 2224/08059 (2013.01); H01L 2224/08503 (2013.01); H01L 2224/81012 (2013.01); H01L 2224/81022 (2013.01); H01L 2224/8181 (2013.01); H01L 2224/81365 (2013.01); H01L 2224/81379 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01);
Abstract
A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.