The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
Dec. 08, 2015
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Rudolf Berger, Regensburg, DE;
Hermann Gruber, Woerth an der Donau, DE;
Wolfgang Lehnert, Lintach, DE;
Guenther Ruhl, Regensburg, DE;
Raimund Foerg, Straubing, DE;
Anton Mauder, Kolbermoor, DE;
Hans-Joachim Schulze, Taufkirchen, DE;
Karsten Kellermann, Altdorf, DE;
Michael Sommer, Nuremberg, DE;
Christian Rottmair, Erlangen, DE;
Roland Rupp, Lauf, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/762 (2006.01); H01L 21/02 (2006.01); H01L 21/20 (2006.01); C30B 25/18 (2006.01); H01L 21/324 (2006.01); H01L 21/265 (2006.01); H01L 21/321 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76254 (2013.01); C30B 25/186 (2013.01); H01L 21/02115 (2013.01); H01L 21/02282 (2013.01); H01L 21/02598 (2013.01); H01L 21/2007 (2013.01); H01L 21/265 (2013.01); H01L 21/324 (2013.01); H01L 21/3212 (2013.01); H01L 21/76251 (2013.01); H01L 29/1608 (2013.01); H01L 29/20 (2013.01); H01L 29/2003 (2013.01);
Abstract
A composite wafer is manufactured by providing a carrier wafer including graphite and a protective layer, forming a bonding layer, and bonding the carrier wafer to a semiconductor wafer through the bonding layer.