The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Dec. 12, 2013
Tokyo Electron Limited, Tokyo, JP;
Masahiro Fukuda, Koshi, JP;
Akihiro Kubo, Koshi, JP;
Taro Yamamoto, Koshi, JP;
Kenzi Yada, Koshi, JP;
Atsushi Ookouchi, Koshi, JP;
Tokyo Electron Limited, Minato-Ku, JP;
Abstract
A substrate liquid treatment apparatus comprises a chuck () that holds and rotates a wafer, a back surface purging nozzle () that discharges a purge gas toward the back surface of the wafer, and a periphery purging nozzlethat discharges the purge gas onto the back surface of the wafer. The back surface purging nozzle has a slit-like opening part extending from a central side to a peripheral side of the substrate in a plan view. Vertical distance between the slit-like opening part and the substrate held by the substrate holding unit increases as approaching an end of the opening part on the central side of the substrate. The periphery purging nozzle discharges the purge gas, toward a central part of the substrate, toward a region on the back surface of the substrate, which region is located radially outside an end of the slit-like opening part of the back surface purging nozzle and radially inside an peripheral edge of the substrate.