The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2017
Filed:
Apr. 03, 2012
Lee-chung LU, Taipei, TW;
Wen-hao Chen, Hsinchu, TW;
Yuan-te Hou, Hsinchu, TW;
Fang-yu Fan, Hukou Township, TW;
Yu-hsiang Kao, Hsinchu, TW;
Dian-hau Chen, Hsinchu, TW;
Shyue-shyh Lin, Zhubei, TW;
Chii-ping Chen, Taichung, TW;
Lee-Chung Lu, Taipei, TW;
Wen-Hao Chen, Hsinchu, TW;
Yuan-Te Hou, Hsinchu, TW;
Fang-Yu Fan, Hukou Township, TW;
Yu-Hsiang Kao, Hsinchu, TW;
Dian-Hau Chen, Hsinchu, TW;
Shyue-Shyh Lin, Zhubei, TW;
Chii-Ping Chen, Taichung, TW;
Abstract
An interconnect structure including a bottom layer over a substrate, where the bottom layer includes at least one bottom layer line and at least one bottom layer via. The interconnect structure further includes a transition layer over the bottom layer, where the transition layer includes at least one transition layer line and at least one transition layer via. The interconnect structure further includes a top layer over the transition layer, where the top layer includes at least one top layer line and at least one top layer via. The at least one transition layer via has a cross sectional area at least 30% less than a cross sectional area of the at least one top layer via.