The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2017

Filed:

Apr. 24, 2015
Applicant:

Tel Epion Inc., Billerica, MA (US);

Inventors:

Kenneth Regan, Beverly, MA (US);

Yan Shao, Andover, MA (US);

Robert K. Becker, Danvers, MA (US);

Christopher K. Olsen, Peabody, MA (US);

Assignee:

TEL Epion Inc., Billerica, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/425 (2006.01); C23C 14/22 (2006.01); H01L 21/265 (2006.01); H01L 21/263 (2006.01); H01L 21/02 (2006.01); H01L 21/285 (2006.01); H01J 37/08 (2006.01); H01J 37/147 (2006.01); H01J 37/317 (2006.01); C23C 14/10 (2006.01);
U.S. Cl.
CPC ...
C23C 14/221 (2013.01); C23C 14/10 (2013.01); H01J 37/08 (2013.01); H01J 37/1477 (2013.01); H01J 37/317 (2013.01); H01J 37/3171 (2013.01); H01L 21/0262 (2013.01); H01L 21/02271 (2013.01); H01L 21/2633 (2013.01); H01L 21/26566 (2013.01); H01L 21/28556 (2013.01); H01J 2237/0812 (2013.01);
Abstract

Provided is a method of controlling a gas cluster ion beam (GCIB) system for processing structures on a substrate. A GCIB system comprises deflection plates for directing a GCIB towards a substrate, the GCIB system coupled to a substrate scanning device configured to move a substrate in three dimensions. The substrate is exposed to the GCIB while the substrate is being moved by the substrate scanning device. A controller is used to control a set of deflection operating parameters comprising a deflection angle φ, voltage differential of the deflection plates, frequency of the deflection plate power, beam current, substrate distance, pressure in the nozzle, gas flow rate in the process chamber, separation of beam burns, duration of the bean burn, and/or duty cycle of the beam deflector output.


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