The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2016

Filed:

Mar. 27, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Kyu Oh Lee, Chandler, AZ (US);

Zheng Zhou, Chandler, AZ (US);

Islam A. Salama, Scottsdale, AZ (US);

Feras Eid, Chandler, AZ (US);

Sasha N. Oster, Chandler, AZ (US);

Lay Wai Kong, Phoenix, AZ (US);

Javier Soto Gonzalez, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0091 (2013.01); B81C 1/00706 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81B 2203/0181 (2013.01); B81C 2203/0145 (2013.01);
Abstract

Methods of forming sensor integrated package devices and structures formed thereby are described. An embodiment includes providing a substrate core, wherein a first conductive trace structure and a second conductive trace structure are disposed on the substrate core, forming a cavity between the first conductive trace structure and the second conductive trace structure, and placing a magnet on a resist material disposed on a portion of each of the first and second conductive trace structures, wherein the resist material does not extend over the cavity.


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