The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
Sep. 30, 2014
Tessera, Inc., San Jose, CA (US);
Debabrata Gupta, Scottsdale, AZ (US);
Yukio Hashimoto, Hitachinaka, JP;
Ilyas Mohammed, Santa Clara, CA (US);
Laura Wills Mirkarimi, Sunol, CA (US);
Rajesh Katkar, San Jose, CA (US);
Tessera, Inc., San Jose, CA (US);
Abstract
A microelectronic assembly includes first and second surfaces, a first thin conductive element, a first conductive projection, and a first fusible mass. The first thin conductive element includes a face that has first and second regions. The first conductive projection covers the first region of the first face. A barrier may be formed along a portion of the first region. The second face includes a second conductive projection that extends away therefrom. The first fusible metal mass connects the first conductive projection to the second conductive projection such that the first surface of the first face is oriented toward the second surface of the second substrate. The first mass extends along a portion of the first conductive projection to a location toward the first edge of the barrier. The barrier is disposed between the first thin element and the first metal mass.