The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2016
Filed:
Dec. 14, 2015
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Wen-Kuei Liu, Xinpu Township, TW;
Teng-Chun Tsai, Hsinchu, TW;
Kuo-Yin Lin, Jhubei, TW;
Shen-Nan Lee, Jhudong Township, TW;
Yu-Wei Chou, Hsinchu, TW;
Kuo-Cheng Lien, Hsinchu, TW;
Chang-Sheng Lin, Baoshan Township, TW;
Chih-Chang Hung, Hsinchu, TW;
Yung-Cheng Lu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
The present disclosure provides a method of manufacturing an integrated circuit device in some embodiments. In the method, a semiconductor substrate is processed through a series of operations to form a topographically variable surface over the semiconductor substrate. The topographically variable surface varies in height across the semiconductor substrate. A polymeric bottom anti-reflective coating (BARC) is provided over the topographically variable surface. Chemical mechanical polishing is performed to remove a first portion of the BARC, and etching effectuates a top-down recessing of the BARC.