The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9441952 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 13, 2016

Filed:

Sep. 27, 2013
Applicants:

Nilanjan Ghosh, Chandler, AZ (US);

Zhiyong Wang, Chandler, AZ (US);

Yu-chun Chen, Chandler, AZ (US);

Shuhong Liu, Chandler, AZ (US);

Inventors:

Nilanjan Ghosh, Chandler, AZ (US);

Zhiyong Wang, Chandler, AZ (US);

Yu-Chun Chen, Chandler, AZ (US);

Shuhong Liu, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 11/06 (2006.01); G01B 11/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
G01B 11/0625 (2013.01); G01B 11/026 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/12042 (2013.01); H05K 3/4644 (2013.01); H05K 2203/163 (2013.01);
Abstract

A method including measuring a first distance to a surface of an integrated circuit substrate or a portion of an integrated circuit package by measuring an angle to it from two known points; introducing a material onto the surface; measuring a second distance to a surface of the film from the two known points; and determining a thickness of the introduced material by subtracting the second distance from the first distance.


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Ghosh, Nilanjan. (2016). Metrology tool for electroless copper thickness measurement for bbul process development monitoring (U.S. Patent No. 9441952). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9441952

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