The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
May. 14, 2012
Yangyang Sun, San Diego, CA (US);
Michel Koopmans, Boise, ID (US);
Jaspreet S. Gandhi, Boise, ID (US);
Josh D. Woodland, Kuna, ID (US);
Brandon P. Wirz, Kuna, ID (US);
Yangyang Sun, San Diego, CA (US);
Michel Koopmans, Boise, ID (US);
Jaspreet S. Gandhi, Boise, ID (US);
Josh D. Woodland, Kuna, ID (US);
Brandon P. Wirz, Kuna, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Methods for forming semiconductor device packages include applying a photoimageable dielectric adhesive material to a major surface of a semiconductor die and at least partially over conductive elements on the semiconductor die. The photoimageable dielectric adhesive material may be removed from over the conductive elements. The conductive elements are aligned with and bonded to bond pads of a substrate, and the semiconductor die and the substrate are adhered with the photoimageable dielectric adhesive material. A semiconductor device package includes at least one semiconductor die including conductive structures thereon, a substrate including bond pads thereon that are physically and electrically connected to the conductive structures, and a developed photoimageable dielectric adhesive material disposed between the semiconductor die and the substrate around and between adjacent conductive structures.