The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2016
Filed:
May. 27, 2014
Hitachi, Ltd., Tokyo, JP;
Akira Soeda, Tokyo, JP;
Chiko Yorita, Tokyo, JP;
Shinichirou Tooya, Tokyo, JP;
Takayuki Ono, Tokyo, JP;
Mitsuru Takahira, Tokyo, JP;
Yuuichi Sekino, Tokyo, JP;
Akira Goto, Tokyo, JP;
Yoshimasa Tashiro, Tokyo, JP;
Hiroyuki Doi, Tokyo, JP;
Tsutomu Sakamoto, Tokyo, JP;
HITACHI, LTD., Tokyo, JP;
Abstract
An electrode connected to a TH pad requiring electric conduction is formed on a bonded surface of a first multilayer substrate having piercing TH to form a solder bump on the electrode. An electrode connected to the TH pad is formed on a bonded surface of a second multilayer substrate to be bonded having a piercing TH at a position opposite the electrode formed on the first multilayer substrate to form a solder bump on the electrode. A three-layered sheet is formed by applying an adhesive as a resin material that is not completely cured to both surfaces of a core material as the cured resin, and has holes at positions corresponding to the TH and the solder bump, respectively. The first and the second multilayer substrates are then laminated having the bonded surfaces facing each other while having the three-layered sheet positioned and interposed therebetween, and batch thermocompression bonded.