Company Filing History:
Years Active: 2016
Title: Innovations of Mitsuru Takahira
Introduction
Mitsuru Takahira is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of technology, particularly in the manufacturing of interlayer connection substrates. His innovative approach has led to the development of a unique patent that enhances the efficiency of electronic components.
Latest Patents
Mitsuru Takahira holds a patent for a "Method of manufacturing an interlayer connection substrate." This patent describes a process where an electrode connected to a through-hole (TH) pad is formed on a bonded surface of a first multilayer substrate. This substrate has piercing THs to form a solder bump on the electrode. Additionally, an electrode connected to the TH pad is formed on a bonded surface of a second multilayer substrate, which is bonded with a piercing TH at a position opposite the electrode on the first multilayer substrate. The process involves creating a three-layered sheet by applying an adhesive resin material that is not completely cured to both surfaces of a core material. This sheet has holes corresponding to the TH and the solder bump. The first and second multilayer substrates are then laminated with the bonded surfaces facing each other, interposing the three-layered sheet, and are batch thermocompression bonded.
Career Highlights
Mitsuru Takahira is associated with Hitachi, Ltd., a leading company in technology and innovation. His work at Hitachi has allowed him to explore and develop advanced manufacturing techniques that contribute to the electronics industry.
Collaborations
Mitsuru has collaborated with notable coworkers, including Akira Soeda and Chiko Yorita. Their combined expertise has fostered an environment of innovation and creativity within their projects.
Conclusion
Mitsuru Takahira's contributions to the field of technology through his patent and work at Hitachi, Ltd. highlight his role as a significant inventor. His innovative methods in manufacturing interlayer connection substrates pave the way for advancements in electronic components.