This inventor holds 1 USPTO granted patent. Top assignee: Hitachi, Ltd.. Active years: 2016.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2016
Title: Shinichirou Tooya: Innovator in Interlayer Connection Substrates
Introduction
Shinichirou Tooya is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of electronics through his innovative patent. His work primarily focuses on methods that enhance the manufacturing processes of multilayer substrates.
Latest Patents
Tooya holds a patent for a "Method of manufacturing an interlayer connection substrate." This invention involves forming electrodes connected to through-holes (TH) on multilayer substrates. The process includes creating solder bumps on these electrodes and utilizing a three-layered sheet with adhesive to bond the substrates effectively. This method improves the efficiency and reliability of electronic connections.
Career Highlights
Tooya is associated with Hitachi, Ltd., a leading company in technology and electronics. His role at Hitachi has allowed him to work on cutting-edge projects that push the boundaries of electronic manufacturing. His expertise in multilayer substrates has positioned him as a key player in the industry.
Collaborations
Tooya collaborates with talented coworkers, including Akira Soeda and Chiko Yorita. Their combined efforts contribute to the advancement of technology within their field.
Conclusion
Shinichirou Tooya's innovative work in the manufacturing of interlayer connection substrates showcases his dedication to improving electronic technologies. His contributions are vital to the ongoing evolution of the electronics industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile