Company Filing History:
Years Active: 2016
Title: Innovations by Yoshimasa Tashiro
Introduction
Yoshimasa Tashiro is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of manufacturing, particularly in the development of interlayer connection substrates. His innovative approach has led to advancements in the efficiency and effectiveness of electronic components.
Latest Patents
Tashiro holds a patent for a method of manufacturing an interlayer connection substrate. This patent describes a process where an electrode connected to a through-hole (TH) pad is formed on a bonded surface of a first multilayer substrate. This substrate has piercing THs to form a solder bump on the electrode. Additionally, an electrode connected to the TH pad is formed on a bonded surface of a second multilayer substrate, which is bonded to the first substrate. This process ensures that the solder bump is accurately positioned on the electrode. A three-layered sheet is created by applying an adhesive resin material that is not completely cured to both surfaces of a core material. This sheet has holes corresponding to the TH and the solder bump. The first and second multilayer substrates are then laminated with the bonded surfaces facing each other, interposing the three-layered sheet, and are batch thermocompression bonded.
Career Highlights
Yoshimasa Tashiro has had a distinguished career at Hitachi, Ltd., where he has been instrumental in advancing manufacturing techniques. His work has not only contributed to the company's success but has also influenced the broader industry.
Collaborations
Tashiro has collaborated with notable colleagues, including Akira Soeda and Chiko Yorita. These partnerships have fostered innovation and have led to the successful development of new technologies.
Conclusion
Yoshimasa Tashiro's contributions to the field of manufacturing, particularly through his patented methods, highlight his role as a key innovator in the industry. His work continues to impact the development of electronic components and manufacturing processes.