The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2016

Filed:

Aug. 21, 2004
Applicants:

Yeow Kheng Lim, Singapore, SG;

Alex See, Singapore, SG;

Tae Jong Lee, Singapore, SG;

David Vigar, Singapore, SG;

Liang Choo Hsia, Singapore, SG;

Kin Leong Pey, Singapore, SG;

Inventors:

Yeow Kheng Lim, Singapore, SG;

Alex See, Singapore, SG;

Tae Jong Lee, Singapore, SG;

David Vigar, Singapore, SG;

Liang Choo Hsia, Singapore, SG;

Kin Leong Pey, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76816 (2013.01); H01L 21/76802 (2013.01); H01L 21/76808 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/53295 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method and structure for slots in wide lines to reduce stress. An example embodiment method and structure for is an interconnect structure comprising: interconnect comprising a wide line. The wide line has a first slot. The first slot is spaced a first distance from a via plug so that the first slot relieves stress on the wide line and the via plug. The via plug can contact the wide line from above or below. Another example embodiment is a dual damascene interconnect structure comprising: an dual damascene shaped interconnect comprising a via plug, a first slot and a wide line. The wide line has the first slot. The first slot is spaced a first distance from the via plug so that the first slot relieves stress on the wide line and the via plug.


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