The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
Sep. 25, 2013
Heejo Chi, Yeoju-gun, KR;
Hangil Shin, Seoul, KR;
Namju Cho, Uiwang-si, KR;
Kyung Moon Kim, Seongnam, KR;
HeeJo Chi, Yeoju-gun, KR;
HanGil Shin, Seoul, KR;
NamJu Cho, Uiwang-si, KR;
Kyung Moon Kim, Seongnam, KR;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
An integrated circuit packaging system and method of manufacture thereof including: a base substrate; an integrated circuit die on the base substrate; vertical interconnects attached to the base substrate around the integrated circuit die; and a single metal layer interposer mounted on the vertical interconnects, the single metal layer interposer including: a routing pattern having interposer contacts and traces, and a dielectric layer on the interposer contacts and traces, a top surface of the interposer contacts coplanar with a top surface of the dielectric layer.