The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2016

Filed:

Jan. 06, 2014
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Chia-Chu Liu, Shin-Chu, TW;

Kuei-Shun Chen, Hsin-Chu, TW;

Shang-Wern Chang, Hsinchu County, TW;

Chih-Yang Yeh, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); C25F 3/00 (2006.01); H01L 21/306 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); C09K 13/00 (2006.01); C09K 13/02 (2006.01); C09K 13/06 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30604 (2013.01); C09K 13/00 (2013.01); C09K 13/02 (2013.01); C09K 13/06 (2013.01); H01L 21/308 (2013.01); H01L 21/31111 (2013.01); H01L 21/31144 (2013.01); H01L 21/32134 (2013.01);
Abstract

A method for etching an ultra thin film is provided which includes providing a substrate having the ultra thin film formed thereon, patterning a photosensitive layer formed over the ultra thin film, etching the ultra thin film using the patterned photosensitive layer, and removing the patterned photosensitive layer. The etching process includes utilizing an etch material with a diffusion resistant carrier such that the etch material is prevented from diffusing to a region underneath the photosensitive layer and removing portions of the ultra thin film underneath the photosensitive layer.


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