The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2016

Filed:

Dec. 27, 2013
Applicants:

Kyu OH Lee, Chandler, AZ (US);

Sasha N. Oster, Chandler, AZ (US);

Feras Eid, Chandler, AZ (US);

Sarah Haney, Cary, NC (US);

Inventors:

Kyu Oh Lee, Chandler, AZ (US);

Sasha N. Oster, Chandler, AZ (US);

Feras Eid, Chandler, AZ (US);

Sarah Haney, Cary, NC (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/008 (2013.01); B81C 1/00547 (2013.01); B81B 7/007 (2013.01); B81B 2207/094 (2013.01); B81C 1/00238 (2013.01); B81C 1/00333 (2013.01); B81C 2203/0172 (2013.01); B81C 2203/0792 (2013.01);
Abstract

The integration of pressure or inertial sensors into an integrated circuit fabrication and packaging flow is described. In one example, a diaphragm is formed by depositing a metal over a first dielectric layer. A second dielectric layer is formed over the diaphragm. A metal mesh layer is formed over the second dielectric. The first dielectric layer is etched under the diaphragm to form a cavity. The cavity is lined with a sealing layer. The cavity is covered to form a chamber adjoining the diaphragm, and the cover is sealed against the cavity.


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