The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Jun. 03, 2014
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Akiteru Ko, Schenectady, NY (US);

Angelique D. Raley, Mechanicville, NY (US);

Kiyohito Ito, Fishkill, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/308 (2006.01); H01L 21/33 (2006.01); H01L 21/033 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0337 (2013.01); H01L 21/3086 (2013.01); H01L 21/31144 (2013.01);
Abstract

A method which is particularly advantageous for improving a Self-Aligned Pattern (SAP) etching process. In such a process, facets formed on a spacer layer can cause undesirable lateral etching in an underlying layer beneath the spacer layer when the underlying layer is to be etched. This detracts from the desired vertical form of the etch. The etching of the underlying layer is performed in at least two steps, with a passivation layer or protective layer formed between the etch steps, so that sidewalls of the underlying layer that was partially etched during the initial etching are protected. After the protective layer is formed, the etching of the remaining portions of the underlying layer can resume.


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