The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
Dec. 11, 2014
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Tien-Kan Chung, Pingzhen, TW;
Wen-Chuan Tai, Dayuan Township, TW;
Yao-Te Huang, Hsinchu, TW;
Hsin-Ting Huang, Bade, TW;
Shang-Ying Tsai, Pingzhen, TW;
Chang-Yi Yang, Hsinchu, TW;
Chia-Ming Hung, Taipei, TW;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02P 9/04 (2006.01); H02M 7/04 (2006.01); G01P 15/11 (2006.01); H02K 15/00 (2006.01); H01F 5/00 (2006.01);
U.S. Cl.
CPC ...
H02M 7/04 (2013.01); G01P 15/11 (2013.01); H01F 5/003 (2013.01); H02K 15/00 (2013.01); Y10T 29/49009 (2015.01);
Abstract
A method of fabricating a device includes forming a moveable plate over a substrate. The method further includes forming an energy harvesting coil in the moveable plate. The method further includes forming at least one connector connecting the movable plate with the substrate, wherein a portion of the energy harvesting coil extends along the at least one connector. The method further includes enclosing the movable plate using a capping wafer.