The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Sep. 30, 2014
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Joseph Neil Greeley, Boise, ID (US);

Duane M. Goodner, Boise, ID (US);

Vishwanath Bhat, Boise, ID (US);

Vassil N. Antonov, Boise, ID (US);

Prashant Raghu, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 29/94 (2006.01); H01L 49/02 (2006.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
H01L 28/75 (2013.01); H01L 28/65 (2013.01); H01L 28/90 (2013.01); B82Y 30/00 (2013.01); H01L 27/10808 (2013.01); H01L 27/10852 (2013.01); Y10S 977/932 (2013.01);
Abstract

Some embodiments include a method of forming a capacitor. An opening is formed through a silicon-containing mass to a base, and sidewalls of the opening are lined with protective material. A first capacitor electrode is formed within the opening and has sidewalls along the protective material. At least some of the silicon-containing mass is removed with an etch. The protective material protects the first capacitor electrode from being removed by the etch. A second capacitor electrode is formed along the sidewalls of the first capacitor electrode, and is spaced from the first capacitor electrode by capacitor dielectric. Some embodiments include multi-material structures having one or more of aluminum nitride, molybdenum nitride, niobium nitride, niobium oxide, silicon dioxide, tantalum nitride and tantalum oxide. Some embodiments include semiconductor constructions.


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