The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2015

Filed:

Aug. 15, 2013
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Kai Wu, Palo Alto, CA (US);

Kiejin Park, San Jose, CA (US);

Sang Ho Yu, Cupertino, CA (US);

Sang-Hyeob Lee, Fremont, CA (US);

Kazuya Daito, Santa Clara, CA (US);

Joshua Collins, Sunnyvale, CA (US);

Benjamin C. Wang, Santa Clara, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/08 (2006.01); C23C 16/14 (2006.01); C23C 16/50 (2006.01); C23C 16/452 (2006.01);
U.S. Cl.
CPC ...
C23C 16/452 (2013.01); C23C 16/08 (2013.01); C23C 16/50 (2013.01);
Abstract

A method for selectively controlling deposition rate of a catalytic material during a catalytic bulk CVD deposition is disclosed herein. The method can include positioning a substrate in a processing chamber including both surface regions and gap regions, depositing a first nucleation layer comprising tungsten conformally over an exposed surface of the substrate, treating at least a portion of the first nucleation layer with activated nitrogen, wherein the activated nitrogen is deposited preferentially on the surface regions, reacting a first deposition gas comprising tungsten halide and hydrogen-containing gas to deposit a tungsten fill layer preferentially in gap regions of the substrate, reacting a nucleation gas comprising a tungsten halide to form a second nucleation layer, and reacting a second deposition gas comprising tungsten halide and a hydrogen-containing gas to deposit a tungsten field layer.


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