The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Jun. 08, 2011
Xinchun LU, Beijing, CN;
Zhenjie Xu, Beijing, CN;
Yongyong He, Beijing, CN;
Tongqing Wang, Beijing, CN;
Pan Shen, Beijing, CN;
Dewen Zhao, Beijing, CN;
Hegeng Mei, Beijing, CN;
Lianqing Zhang, Beijing, CN;
Zhaohui Pei, Beijing, CN;
Jianbin Luo, Beijing, CN;
Xinchun Lu, Beijing, CN;
Zhenjie Xu, Beijing, CN;
Yongyong He, Beijing, CN;
Tongqing Wang, Beijing, CN;
Pan Shen, Beijing, CN;
Dewen Zhao, Beijing, CN;
Hegeng Mei, Beijing, CN;
Lianqing Zhang, Beijing, CN;
Zhaohui Pei, Beijing, CN;
Jianbin Luo, Beijing, CN;
HWATSING TECHNOLOGY CO., LTD., Jinnan District, Tainjin, CN;
Abstract
A chemical-mechanical polishing machine includes a work table, polishing platen mounted onto the work table, pad conditioner and slurry-delivery device mounted on the work table and disposed near the polishing platen, and polishing-head support mounted on the work table and including a base plate and supporting side plates. The base plate is formed with a groove in a 'thickness' direction. A loading and unloading table is mounted on the work table, disposed below the base plate, and opposed to the polishing platen. A polishing head is rotatably disposed on the polishing-head support, movable in the longitudinal direction, and passes through the groove to extend downwardly. A robotic manipulator is disposed near the work table for placing a wafer on the loading and unloading table and taking the wafer away from it. A chemical-mechanical polishing apparatus includes an array of a plurality of the machine.