The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2015

Filed:

Jan. 17, 2014
Applicant:

Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;

Inventors:

Audrey Hsiao-Chiu Hsu, Hsinchu, TW;

Fu-Kai Yang, Hsinchu, TW;

Mei-Yun Wang, Hsin-Chu, TW;

Hsien-Cheng Wang, Hsinchu, TW;

Shih-Wen Liu, Taoyuan County, TW;

Hsin-Ying Lin, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/088 (2006.01); H01L 21/311 (2006.01); H01L 21/321 (2006.01); H01L 23/532 (2006.01); H01L 21/3205 (2006.01); H01L 21/768 (2006.01); H01L 21/263 (2006.01); H01L 21/8234 (2006.01); H01L 29/66 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 27/088 (2013.01); H01L 21/2633 (2013.01); H01L 21/31111 (2013.01); H01L 21/3212 (2013.01); H01L 21/32051 (2013.01); H01L 21/32053 (2013.01); H01L 21/32105 (2013.01); H01L 21/76897 (2013.01); H01L 21/823475 (2013.01); H01L 23/53261 (2013.01); H01L 29/4933 (2013.01); H01L 29/665 (2013.01);
Abstract

A method of forming a contact structure of a gate structure is provided. In the method, an oxidation layer and a first sidewall layer disposed between a first metal gate and a second metal gate are etched to expose an underlying silicon substrate. A silicide portion defined by a contact profile is deposited in the exposed portion of the silicon substrate. A second sidewall layer substantially covers the first sidewall layer and at least partially covering the silicide portion is formed after depositing the silicide portion. A metal glue layer is deposited around the first metal gate and the second metal gate defining a trench above the silicide portion. A metal plug is deposited within the trench.


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