The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2015
Filed:
Dec. 15, 2006
John Boyd, Hillsboro, OR (US);
Yezdi Dordi, Palo Alto, CA (US);
Tiruchirapalli Arunagiri, Fremont, CA (US);
Benjamin W. Mooring, Austin, TX (US);
John Parks, Hercules, CA (US);
William Thie, Mountain View, CA (US);
Fritz C. Redeker, Fremont, CA (US);
Arthur M. Howald, Pleasanton, CA (US);
Alan Schoepp, Ben Lomond, CA (US);
David Hemker, San Jose, CA (US);
Carl Woods, Aptos, CA (US);
Hyungsuk Alexander Yoon, San Jose, CA (US);
Aleksander Owczarz, San Jose, CA (US);
John Boyd, Hillsboro, OR (US);
Yezdi Dordi, Palo Alto, CA (US);
Tiruchirapalli Arunagiri, Fremont, CA (US);
Benjamin W. Mooring, Austin, TX (US);
John Parks, Hercules, CA (US);
William Thie, Mountain View, CA (US);
Fritz C. Redeker, Fremont, CA (US);
Arthur M. Howald, Pleasanton, CA (US);
Alan Schoepp, Ben Lomond, CA (US);
David Hemker, San Jose, CA (US);
Carl Woods, Aptos, CA (US);
Hyungsuk Alexander Yoon, San Jose, CA (US);
Aleksander Owczarz, San Jose, CA (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
A cluster architecture and methods for processing a substrate are disclosed. The cluster architecture includes a lab-ambient controlled transfer module that is coupled to one or more wet substrate processing modules. The lab-ambient controlled transfer module and the one or more wet substrate processing modules are configured to manage a first ambient environment. A vacuum transfer module that is coupled to the lab-ambient controlled transfer module and one or more plasma processing modules is also provided. The vacuum transfer module and the one or more plasma processing modules are configured to manage a second ambient environment. And, a controlled ambient transfer module that is coupled to the vacuum transfer module and one or more ambient processing modules is also included. The controlled ambient transfer module and the one or more ambient processing modules are configured to manage a third ambient environment. The cluster architecture therefore enables controlled processing of the substrate in either the first, second or third ambient environments, as well as during associated transitions.