The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2015

Filed:

Sep. 02, 2009
Applicants:

Aleksey Petrenko, Milpitas, CA (US);

Christian Wolters, Campbell, CA (US);

Zhongping Cai, Fremont, CA (US);

Anatoly Romanovsky, Palo Alto, CA (US);

Bret Whiteside, Gilroy, CA (US);

Inventors:

Aleksey Petrenko, Milpitas, CA (US);

Christian Wolters, Campbell, CA (US);

Zhongping Cai, Fremont, CA (US);

Anatoly Romanovsky, Palo Alto, CA (US);

Bret Whiteside, Gilroy, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/88 (2006.01); G01N 21/95 (2006.01); G02B 27/09 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01N 21/8806 (2013.01); G02B 27/0972 (2013.01);
Abstract

A method and apparatus for producing high frequency dynamically focused oblique laser illumination for a spinning wafer inspection system. The focus is changed by changing the beam direction incidence angle so as to bring focal spot onto the wafer surface. Disclosed herein is a system and method for automatic beam shaping (i.e., spot size) and steering (i.e., position) for a spinning wafer inspection system, combined into a single module. Also disclosed is a method and system for measuring the beam position/size/shape and angle with sufficient resolution to make corrections using feedback from the monitor.


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