The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Mar. 20, 2014
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Anthony I. Chou, Beacon, NY (US);

Arvind Kumar, Beacon, NY (US);

Edward P. Maciejewski, Wappingers Falls, NY (US);

Shreesh Narasimha, Beacon, NY (US);

Dustin K. Slisher, Wappingers Falls, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 29/423 (2006.01); H01L 29/739 (2006.01); H01L 29/861 (2006.01); H01L 27/06 (2006.01); H01L 27/12 (2006.01); H01L 21/265 (2006.01); H01L 21/77 (2006.01);
U.S. Cl.
CPC ...
H01L 21/8238 (2013.01); H01L 21/77 (2013.01); H01L 29/42364 (2013.01); H01L 29/7391 (2013.01); H01L 29/861 (2013.01); H01L 21/823835 (2013.01); H01L 27/0629 (2013.01); H01L 27/1203 (2013.01); H01L 21/265 (2013.01);
Abstract

A method of fabricating a semiconductor structure provided with a plurality of gated-diodes having a silicided anode (p-doped region) and cathode (n-doped region) and a high-K gate stack made of non-silicided gate material, the gated-diodes being adjacent to FETs, each of which having a silicided source, a silicided drain and a silicided HiK gate stack. The semiconductor structure eliminates a cap removal RIE in a gate first High-K metal gate flow from the region of the gated-diode. The lack of silicide and the presence of a nitride barrier on the gate of the diode are preferably made during the gate first process flow. The absence of the cap removal RIE is beneficial in that diffusions of the diode are not subjected to the cap removal RIE, which avoids damage and allows retaining its highly ideal junction characteristics.


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